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《Modern Machinery》 2003-01
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Design of the Bondhead Bevice for High Speed Die Bonder

He wei-feng Zhang shao-qiu  
This paper introduces the original struchure and principle of the bondhead device for high speed die bonder designed by author.The principal design parameters and formula are provided.
【CateGory Index】: TG439
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【References】
Chinese Journal Full-text Database 5 Hits
1 LI Ke-tian,CHEN Xin,GAO Jian,WU Xiao-hong,WANG Xiao-chu(Guangdong University of Technology,Guangzhou 510090,China);Design and Principle of the Mechanical Structure of the Automatic Die-bonder[J];Packaging Engineering;2006-04
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4 LI Ke-tian, CHEN Xin, WU Xiao-hong, WANG Xiao-chu, HE Han-wu (Guangdong University of Technology, Guangzhou 510090);Moving Structure Design of the Bonding Head for a Die Bonder with Oblique Plane and Quadrilateral Connecting Rods[J];Mechanical Science and Technology;2005-05
5 Li Ketian Chen Xin Wu Xiaohong Wang Xiaochu He Hanwu Peng Weidong Guangdong University of Technology, Guangzhou,510090;3D Cam Conveyor Structure Design of Die Bonder Leadframe[J];China Mechanical Engineering;2005-01
【Co-references】
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1 WANG Xiao, WANG Hui (SGNEC Assembly Process Department, 45 Ba DaChu Rd., Shi Jing Shan Distrct 100041);Improve The Die Bond Position Precision[J];Equipment For Electronic Products Manufacturing;2004-04
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6 LI Ke-tian, CHEN Xin, WU Xiao-hong, WANG Xiao-chu, HE Han-wu (Guangdong University of Technology, Guangzhou 510090);Moving Structure Design of the Bonding Head for a Die Bonder with Oblique Plane and Quadrilateral Connecting Rods[J];Mechanical Science and Technology;2005-05
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8 ZHANG Shaoqiu,WANG Xiaochu,CHEN Xin(Guangdong University of Technology,Guangzhou 510090,China);Design of the Bondhead Device of Die Bonder[J];Machinery & Electronics;2003-03
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10 WANG Xiankui, et al. (Tsinghua University);The Analysis for Real-Time Performance and Realization of CNC System on Middle-Convex and Varying Ellipse Piston Machining[J];Manufacturing Technology & Machine Tool;2004-03
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3 LIU Ji-an WENG Ji-zhao LI Ke-tian LIU Jian-qi HUANG Xiang-xiu (Guangdong University of Technology,Guangzhou 510006,China);Design of Bonding Head of IC Encapsulation with Flexible Hinges Straight Buffer Mechanism[J];Packaging Engineering;2007-08
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