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《Journal of Xiamen University(Natural Science)》 2019-01
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Study on magnetic compound fluid polishing process of 3D printing microstructure workpiece

LIN Longqiao;WANG Zhenzhong;CHEN Shiping;School of Aerospace Engineering,Xiamen University;  
In the precision processing of microstructures,the uneven material removal must be skillfully controlled such that the original three-dimensional morphology of the microstructure is not destroyed.The test platform for 3 Dprinted microstructure work-piece polishing is established.Effects of spindle speed,machining gap,polishing time and polishing path on microstructure conformal polishing and three-dimensional profile removal characteristics are primarily studied.Experimental results show that the conformal coefficient decreases with the increase of polishing time,while the change of spindle speed and machining gap exerts little effect on the conformal coefficient.The method of contour line moving polishing exhibits greater conformal coefficients than the horizontal moving counterpart does.The conformal effect is better for the microstructure work linear array with hemispheroid and circular array with rings,the section of which is semicircle,but not for triangular pyramid workpiece.
【Fund】: 国家自然科学基金(51675453);; 深圳市科技计划项目(JCYJ20160517103720819)
【CateGory Index】: TP391.73
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