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《Journal of Vibration and Shock》 2007-01
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Xu Peng,Zu Jing,Li Le(Key Lab of Instrumentation Science & Dynamic Measurement of Ministry of Education,North University of China,Taiyuan 030051)  
The Hopkinson bar is employed to perform a test about anti-multi-g-shock capability of a complex programmable logic device(CPLD) used in circuit modules of on-board memory testing equipment of a projectile.The CPLD is no-potted and potted with epoxy resin along vertical or parallel direction to the shock.The result shows that its anti-multi-g-shock capability is high,and it is independent upon the shock direction.At last,the CPLD will not be failure within the corresponding acceleration amplitude range when the projectile penetrates all kinds of targets.
【Fund】: 武器装备预研基金项目(51847040104HT1401)
【CateGory Index】: TN791
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Chinese Journal Full-text Database 4 Hits
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2 HUAN Yong 1 ZHANG Taihua 1 YANG Yemin 1 ZENG Zhaojun 2 1. State Key Laboratory of Nonlinear Mechanics (LNM), Institute of Mechanics, Chinese Academy of Sciences, Beijing 100080, P.R.China; 2. Institute of Microelectronics, Peking University, Beijing 100871, P.R.China);Study of Shock-resistibility of High-g Microaccelerometer Chip Through Impact Using Hopkinson Bar[J];Journal of Transcluction Technology;2003-02
3 Fan Jinbiao Xu Peng Li Donghong Zu Jing (Key Laboratory of Instrumentation Science and Dynamic Testing, North China Institute of Technology,Taiyuan 030051,China);Miniature Flight Data Recorder for Hard Target Weapons[J];Chinese Journal of Scientific Instrument;2004-S1
4 Chen Xun Zhao Mei Meng Guang (State Key Laboratory of Vibration,Shock & Noise,Shanghai Jiao Tong University,Shanghai 200030);ANALYSIS ON DYNAMIC BEHAVIOR OF PBGA SOLDER JOINTS UNDER SHOCK LOADING[J];Journal of Vibration and Shock;2004-04
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3 YANG Chao, TIAN Shi-Yu (No 52 Institute of China Ordnance Industry, Baotou 014034, China);Study on relation of wave resistence property of interface between metals and ceramics to material states[J];Ordnance Material Science and Engineering;2003-02
4 YANG Chao, ZHAO Bao - rang, FU Ke - qin, TIAN Shi - yu, ZHANG Bao - ping, LI Can- bo (P.O.Box4,Baotou 014034,China; Beijing Inst. of Technology,Beijing 100081,China);Research of plastic wave velocity in tungsten alloy penetrators during penetrating[J];Ordnance Material Science and Engineering;2003-04
5 WANG Jian-feng, DING Hua-dong FU Su-li(Faculty of Material Science and Engineering, Academy of Annored Force Engineering, Beijing 100072, China; Training Department, Academy of Armored Force Engineering, Beijing 100072, China);A primary discussion about propagation process of elastic wave in B_4C matrix composite[J];Ordnance Material Science and Engineering;2005-01
6 SUN Su-jie1,ZHAO Bao-rong2,WANG Jun1,WANG Zhi-qiang1,BAI Rong1(1.Yantai Sub-institute of China Ordnance Industries Group Corporation,Yantai 264003,China 2.Ningbo Branch of China Academy of Ordnance,Ningbo 315103,China);Study on the penetration performance of ceramic armors with different backing plate[J];Ordnance Material Science and Engineering;2006-02
7 Jin Wei,Sang Wenbin,Zhang Qi and Teng Jianyong(School of Materials Science and Engineering,Shanghai University,Shanghai 201800,China);Investigation of Adhesive Fillet Height in SCSP by Finite Element Methods[J];Chinese Journal of Semiconductors;2004-02
8 He Ping,Peng Yaowei,Wu Jianbo,Meng Xuanhua and He Guowei(Department of Material Science,Fudan University,Shanghai 200433,China);Solder Joint Fatigue Reliability of vf-BGA Package[J];Chinese Journal of Semiconductors;2004-07
9 Wang Jianxing (College of Arch., North China Univ. of Tech., 100041, Beijing, China);A Theoretical Study on the Harmonic Thermoviscoelastic Waves in 1~3D Media[J];JOURNAL OF NORTH CHINA UNIVERSITY OF TECHNOLOGY;1999-01
10 Zang Taocheng Hu Huanxing * Shao Qi * (Nanjing University of Science and Technology, Nanjing 210094; *Xi′an Modern Chemistry Research Institute, Xi′an 710065);The Performance Study of Shaped Charge Liner[J];CHINESE JOURNAL OF EXPLOSIVES & PROPELLANTS;1998-04
China Proceedings of conference Full-text Database 10 Hits
1 Bo Song1, Xiquan Jiang1, 2 , Weinong Chen1 1 Department of Aerospace and Mechanical Engineering, The University of Arizona, Tucson, AZ 85721-0119, USA. 2 Department of Mechanics and Mechanical Engineering, University of Science and Technology of China, Hefei, 230027, P. R. China.;Pulse Shaping Techniques in Split Hopkinson Pressure Bar (SHPB) Experiments[A];[C];2004
2 Lin Peng1,2, PENG Chang-xian1, WANG Xiao-jun2,TAN Hong-mei1 (1. Northwest Institute of Nuclear Technology, Xi’an 710024, China 2. CAS key Laboratory of Mechanical Behavior and Design of Materials, USTC, Hefei, 230026;)  ;Application of Piezoelectric Quartz Measuring Technique in Thermal Shock Waves Induced By Irradiation[A];[C];2004
3 Xu Peng,Zu Jing,Li Le Key Laboratory of Instrumentation Science & Dynamic Measurement Ministry of Education,North University of China,Taiyuan,030051;The experiment and failure mechanism analysis of crystal oscillator in high g shock[A];[C];2007
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5 YE Wei~1 FAN You-hua~2 ZHAO Wen-guang~1 RONG Qin~2 (1.School of Civil Engineering and Mechanics,Huazhong University of Science & Technology,Wuhan 430074,China; 2.Shenzhen Graduate School,Harbin Institute of Technology,Shenzhen 518055,China);The Influence of the Thickness of the Steel Tube on the Length Testing of the Concrete-Filled Steel Tube Pile by Means of Stress Wave[A];[C];2005
6 WANG Peng-hui~(1,2),XU Jin-yu~1,RONG Shu-jian~3,ZHAI Yi~1 (1.Department of Airfield and Building Engineering,Air Force Engineering University Engineering Institute,Shanxi Xi'an 710038,China, 2.The First Brigade of Construction & Installation of Chinese Air Force,Beijing 100089,China: 3.The Ninth Engineering Brigade of Chinese Airport Construction,Sichuan Xinjin 611430,China);Analysis on Stress Uniformity in Impact Compress Examination Using Large Diameter Split Hopkinson Pressure Bar[A];[C];2008
7 Zeng Hui Li Huanqiu (Th 3rd Science and Technology Institute, Corps, General Staff, PLA , Lou Yang 471023);ON DYNAMIC MATCH OF RIGID PRESSURE GAUGE MOUNTED ON THE SURFACE BETWEEN STRUCTURE AND GEOMATERIAL BY FEM[A];[C];1996
8 ;SHPB Experimental Technology of Stress Wave Propagation Law in Layered Medium[A];[C];2008
9 Tian Lanqiao (Institute of Mechanics,Academia Science,Beijing 100080) C.Sturt B.Dodd (Beijing University,U.K.);STUDY ON DYNAMIC TORSIONAL TEST OF AI-Li ALLOY[A];[C];2007
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2 Gu Jing,Wang Jun,Lu Zhen,Yu Hongkun,and Xiao Fei(Department of Materials Science,Fudan University,Shanghai 200433,China);Failure Analysis and Thermal Stress Simulation in a Stacked Die Package[J];Chinese Journal of Semiconductors;2005-06
3 Xu Gaowei Wu Yanhong,Zhou Jian,and Luo Le(Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences,Shanghai 200050,China);Development of a Three-Dimensional Multichip Module Based on Embedded Substrate[J];Journal of Semiconductors;2008-09
4 Li Shiyi Li;Jie Liu;Minjie;Shang Jihong(BeiJing Institute of Technology);PRINCIPLES AND METHODS OF DESIGN FOR THE STATE CONTROLLER OF ELECTRONIC FUZE SAFETY SYSTEMS[J];Acta Armamentarii;1994-03
5 Gao Shiqiao (Depart of Mechatronic Engineering, Beijing Institute of Technology, Beijing, 100081);A STUDY ON THE MODULARIZATION DESIGN OF FUSE SYSTEMS[J];Acta Armamentarii;2001-02
6 QIAN Li-zhi1,2(1.National Synchrotron Radiation Laboratory,University of Science and Technology of China,Hefei 230031,Anhui,China;2.Artillery Academy of PLA,Hefei 230031,Anhui,China);Study of Projectile-loaded Equipment Against High Overload[J];Acta Armamentarii;2007-08
7 ZHANG Song~1,FANG Xiao-ma~2,YAN Ping-hua~1,LIAO Ke~1(1.College of Electronic Information Science, SCU, Chengdu 610064, China;2.Anhui Power Transmission and Transformation Engineering Company,Hefei,230031,China);Extension of DSP out-memorizer by CPLD[J];Journal of Chengdu University of Information Technology;2005-01
8 HUAN Yong 1 ZHANG Taihua 1 YANG Yemin 1 ZENG Zhaojun 2 1. State Key Laboratory of Nonlinear Mechanics (LNM), Institute of Mechanics, Chinese Academy of Sciences, Beijing 100080, P.R.China; 2. Institute of Microelectronics, Peking University, Beijing 100871, P.R.China);Study of Shock-resistibility of High-g Microaccelerometer Chip Through Impact Using Hopkinson Bar[J];Journal of Transcluction Technology;2003-02
9 DONG Jian(The MOE Key Laboratory of Mechanical Manufacture and Automation,Zhejiang University of Technology,Hangzhou 310032,China);Package of Silicon Micromachined Shock Accelerometer and Package Performance Analysis[J];Chinese Journal of Sensors and Actuators;2008-06
10 Zu Jing Shen Xiangnan Zhang Zhijie Shao Chengzhong (North China Institute of Technology);Current Developments of Dynamic Testing and Measuring Technology[J];Journal of Test And Measurement Technology;1996-02
【Secondary References】
Chinese Journal Full-text Database 4 Hits
1 WAN Xiang,ZHANG Meng-yang(Beijing Institute of Satellite Information Engineering,Beijing 100086,China);Application of GPS relative positioning in gravity satellite KBR ranging[J];Electronic Design Engineering;2010-09
2 XU Chao1,WANG Li1,LV Hao-tun1,2,LIU Zhen-qiang1(1School of Mechatronics Engineering,NUC,Taiyuan 030051,China)(2Instrument Science and Optoelectronic Engineering,Beijing University of Aeronautics and Astronautics,Beijing 100191,China);Data acquisition system for transient collision signal based on DSP[J];Machinery Design & Manufacture;2011-03
3 YE Song,WANG Xiao-lei,ZHOU Shu-dao,MU Xin-cang (School of Meteorology,PLA University of Science and Technology,Nanjing 211101,China);Research on GPS attitude and heading system(beeline) station-keeping testing[J];China Measurement & Test;2010-03
4 Liu Haitao,Pei Dongxing,Fan Jinbiao,Wang Yan (Key Lab Instrumentation Science & Dynamic Measurement of the Ministry Education,North University of China,Shanxi Taiyuan,030051);Design of the missile acceleration test system in high acceleration test sampling frequency[J];Electronic Test;2010-12
【Secondary Citations】
Chinese Journal Full-text Database 6 Hits
1 CHEN Liu,ZHANG Qun,WANG Guo- zhong,XIE Xiao- ming and CHENG Zhao- nian ( SIM Daimler Chrysler L aboratory,Shanghai Institute of Metallurgy,The Chinese Academy of Sciences,Shanghai 2 0 0 0 5 0 ,China);Thermal Cycle Failure of Sn Pb Solder Jointfor Flip Chip Package and Effects of Underfill Material[J];Chinese Journal of Semiconductors;2001-01
2 Zhou Dejian, Pan Kailin,Wu Zhaohua(Guilin Institute of Electronic Technology, Guilin\ 541004) Chen Zichen(Zhejiang University, Hangzhou\ 310027);Modeling and Predicting Solder Joint Shapes of Ball Grid Array[J];CHINESE JOURNAL OF SEMICONDUCTORS;1999-01
3 Liu Xiaohu a, Liu Ji b, Wang cheng a, Dang Ruirong c( a .Central China University of Science and Technology,Wuhan,430073) ( b . No .212 Institute of Weapons,Xi ′an,710063) ( c .National Defence Laboratory of Science and Technology for D;EXPERIMENTAL STUDIES ON THE PROJECTILE PENETRATING NORMALLY INTO A PLAIN CONCRETE[J];EXPLOSION AND SHOCK WAVES;1999-04
4 ;Solder Joint Shapes Theory of SMT andVirtual Evolving Technology of SMT Solder Joint[J];Electro-mechanical Engineering;2001-01
5 Li Xiaoming,Gao Zexi,Lu Shanwei (205 Office Beijing University of Aero & Astro,Beijing 100083);Optimal Placement of Electronic Components in Electronic Board[J];ACTA ELECTRONICA SINICA;1999-07
6 XIA Kaiwen CHENG Jingyi HU Shisheng (Department of Modern Mechanics, University of Science and Technology of China, Hefei, 230026);Application of SHPB Apparatus to the Measurement of High Temperature Dynamical Mechanical Behavior of Materials[J];JOURNAL OF EXPERIMENTAL MECHANICS;1998-03
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