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《Journal of Vibration and Shock》 2011-07
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Dynamic analysis of multi wire saw

FENG Yan-bo,SUN Tao(School of Mechatronics Engineering,Harbin Institute of Technology,Harbin 150001,China)  
Multi wire saw technique is a new technology in semiconductor wafer processing industry,and becomes the most advanced processing method in silicon slicing with unique advantages.The dynamic performance of a machine tool structure directly relates to the quality of material processing.To ensure the stability of machine tool operation,the dynamic performance of a machine tool and the rationality of its mechanical structure was studied.The three-dimensional machine body structure model was established.The finite element method based on ANSYS software was used to conduct the modal analysis of the system,natural frequencies and modal shapes were obtained.The vibration characteristics of the system by using the dynamic analysis software ADAMS.The frequency responses of the key components of the system were obtained.The correctness of the mechanism design was evaluated,and the direction was pointed out for further improvement.The results were use ful for improving the behavior of multi wire saw and raising slicing quality.
【Fund】: 高等学校学科创新引智计划资助(B07018)
【CateGory Index】: TN305
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