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《Journal of Vibration and Shock》 2015-22
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Finite element model updating of printed circuit board assembly based on response surface methodology

WANG Kai-shan;LI Chuan-ri;PANG Yue-chan;GUO Heng-hui;Beijing University of Aeronautics and Astronautics,School of Reliability and Systems Engineering;  
On the premise of taking the materials of the printed circuit board and its components as orthotropic,a method based on response surface was proposed to update the finite element model( FEM) of printed circuit board assembly( PCBA). The parameters which have great influence on the modal frequencies of PCBA were screened out and taken as the updating parameters by correlation analysis. The sample points were acquired by using an appropriate experimental design according to the number of the updating parameters to construct a polynomial response surface model.The least squares method was used to determine the polynomial coefficients and then to test the fitting accuracy of response surface. The absolute value of error between the result of the calculated response surface and that of an actual test was taken as an objective function. The optimized parameters were obtained taking advantage of the iterative calculation of the multiple objectives genetic algorithm( MOGA). The updated model was then obtained by substituting the optimized parameters into the non-updated FEM. Taking the PCBA of an aircraft electronic product as an example,the comparison between the modal frequencies of non-updated and updated FEM shows that the relative error of modal frequencies of the updated FEM to the actual test is obviously reduced and thus verifies the effectiveness of the model updating methodology suggested.
【CateGory Index】: TN41
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