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《Journal of Zhejiang University(Engineering Science)》 2009-01
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Defects in micro hot embossing process

HE Yong,FU Jian-zhong,XU Yue-tong,CHEN Zi-chen(Zhejiang Provincial Key Laboratory of Advanced Manufacturing Technology,Zhejiang University,Hangzhou 310027,China)  
The reason causing the structure defects induced in micro hot embossing process was investigated to get better product quality.The defects in the cooling and demolding step were analyzed with finite element method(FEM).The simulation results showed that large thermal stress concentration can be found in the cooling step due to the different coefficients of thermal expansion between the polymer and the mold,while keeping imprint pressure will aggravate the phenomenon and result in damage at the bottom of micro patterns.Fracture and necking can be easily induced by the adhesion between the polymer and the mold when demolding high aspect ratio patterns.Incline structures can be found when using manual demolding and wrap structure can be caused when using common demolding device.Hot embossing process was optimized and a new pneumatic demolding device was designed.Successful fabrication of fine patterns with high aspect ratio verified the improvements.
【Fund】: 国家“863”高技术研究发展计划资助项目(2002AA421150);; 国家教育部博士点基金资助项目(20030335091)
【CateGory Index】: TB324
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【Co-citations】
Chinese Journal Full-text Database 3 Hits
1 LIU Gang TIAN Yangchao (National Synchrotron Radiation Laboratory,University of Science & Technology of China,Hefei 230026);Research and Application of LIGA Process at Nationol Synchrotron Radiation Laboratory[J];Chinese Journal of Mechanical Engineering;2008-11
2 HE Yong~(1,2) FU Jianzhong~(1,2) CHEN Zichen~(1,2) (1.College of Mechanical and Energy Engineering,Zhejiang University,Hangzhou 310027;2.Zhejiang Province Key Laboratory of Advanced Manufacturing Technology,Hangzhou 310027);Demolding Defects and the Design of Demolding Device in Micro Hot Embossing Process[J];Chinese Journal of Mechanical Engineering;2008-11
3 WANG Yiqing1,ZHANG Qing1,GAN Daiwei2,KUANG Xinbin1,DING Yucheng1, CHEN Feng3,LIU Hongzhong1(1.School of Mechanical Engineering,Xi'an Jiaotong University,Xi'an 710049,China; 2.NC Engineering Department,College of Shaanxi Institute of Technology,Xi'an 710302,China; 3.School of Electronics and Information Engineering,Xi'an Jiaotong University,Xi'an 710049,China);A Research on Stress and Demolding Temperature During Hot Embossing Process of Microlens Array[J];Journal of Xi'an Jiaotong University;2013-04
【Co-references】
Chinese Journal Full-text Database 10 Hits
1 Chu Jinkui1,2,Guo Qing1,2,Meng Fantao1,2,Han Zhitao1,2(1.Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education,Dalian University of Technology,Dalian 116023,China;2.Key Laboratory for Micro/Nano Technology and System of Liao Ning Province,Dalian 116023,China);Simulation Analysis of the Filling Process of Polymer in Hot Embossing[J];Semiconductor Technology;2008-11
2 CHEN Fang,GAO Hong-jun,LIU Zhong-fan (College of Chemistry and Molecular Engineering,Peking University,Beijing 100871,China);Hot embossing lithography[J];Micronanoelectronic Technology;2004-10
3 ZHANG Zhen yuan, LING Genhua(Nangjing Fiberglass Research & Design Institute, Nanjing 210012);INFRARED OPTICAL FIBERS MADE FROM CHALCOGENIDE GLASS[J];Fiber Glass;2005-01
4 YIN Lei , LIU Hong-zhong, DING Yu-cheng, LU Bing-heng (State Key Laboratory for Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, China);Study on Fabrication of 3D Micro-Structure in Polymer Photovoltaic Cells Based on Nanoimprint Lithography Technology[J];Chinese Journal of Sensors and Actuators;2006-05
5 FAN Dong-sheng, XIE Chang-qing, CHEN Da-peng(Key Laboratory of Nano-Fabrication and Novel Devices Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China);Stamp Fabrication in Nanoimprint Lithography[J];Equipment For Electronic Products Manufacturing;2005-02
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7 LUO Kang,DUAN Zhi-yong(Zhengzhou University,Zhengzhou 450001,China);Nanoimprint Technology and Applications[J];Electronics Process Technology;2009-05
8 XUE Jian-qiang, XU Man, GONG Yue-qiu, ZHAO Xiu-jian (Key Laboratory of Silicate Material Sciences and Engineering of China Ministry of Education, Wuhan Technology of University, Wuhan 430070, China);Preparation, Characteristic and Application of Chalcogenide Glasses[J];Optoelectronic Technology & Information;2003-04
9 Chen Guorong (Dept.of Inorganic Materials,East China University of Technology,Shanghai 200237) Zhang Xianghua (Laboratoire des Verres et Céramiques,Universite de Rennes I,35042 Rennes Cedex,France);Development of Fine Molded Chalcogenide Glasses for IR Night Vision[J];Bulletin of the Chinese Ceramic Society;2004-01
10 HE Yong,FU Jian-zhong,CHEN Zi-chen (Department of Mechanical Engineering,Microsystem Research and Development Center,Zhejiang University,Hangzhou 310027,China);Study on polymer flow profile in micro hot embossing[J];Optics and Precision Engineering;2008-02
【Secondary References】
Chinese Journal Full-text Database 1 Hits
1 YIN Shaohui ZHU Kejun YU Jianwu ZHU Yongjian CHEN Fengjun(National Engineering Research Center for High Efficiency Grinding,Hunan University,Changsha 410082);Micro Aspheric Glass Lens Molding Process[J];Journal of Mechanical Engineering;2012-15
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