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《Journal of Zhejiang University(Engineering Science)》 2009-01
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Defects in micro hot embossing process

HE Yong,FU Jian-zhong,XU Yue-tong,CHEN Zi-chen(Zhejiang Provincial Key Laboratory of Advanced Manufacturing Technology,Zhejiang University,Hangzhou 310027,China)  
The reason causing the structure defects induced in micro hot embossing process was investigated to get better product quality.The defects in the cooling and demolding step were analyzed with finite element method(FEM).The simulation results showed that large thermal stress concentration can be found in the cooling step due to the different coefficients of thermal expansion between the polymer and the mold,while keeping imprint pressure will aggravate the phenomenon and result in damage at the bottom of micro patterns.Fracture and necking can be easily induced by the adhesion between the polymer and the mold when demolding high aspect ratio patterns.Incline structures can be found when using manual demolding and wrap structure can be caused when using common demolding device.Hot embossing process was optimized and a new pneumatic demolding device was designed.Successful fabrication of fine patterns with high aspect ratio verified the improvements.
【Fund】: 国家“863”高技术研究发展计划资助项目(2002AA421150);; 国家教育部博士点基金资助项目(20030335091)
【CateGory Index】: TB324
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【Secondary References】
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