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《China Mechanical Engineering(中国机械工程)》 2009-14
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Prediction and Measurement of Subsurface Damage Thickness of Silicon Wafer in Wire Saw Slicing

Gao Yufei Ge Peiqi Li Shaojie Hou Zhijian Shandong University,Jinan,250061  
An abrasive machining in wire sawing process was considered as moving indention subjected to normal force and tangential force.Based on indentation fracture mechanics theory,the calculation formula of median crack propagation length was analyzed by synthetically considering the contributions of elastic stress field and residual stress field beneath the abrasive.The depth of median crack propagation layer was postulated as equal as to the subsurface damage layer thickness(dSSD),and the lateral crack depth was equal to the surface roughness Rz,thereby a theoretical model of relationship between dSSD and Rz was founded for predicting the dSSD.Moreover,a bonded interface sectioning technique with scanning electron microscope(SEM) was employed to measure the silicon dSSD.The results indicate that the experimental measurement values coincide with the theoretical prediction ones comparatively.The theoretical model can be used for predicting dSSD rapidly,expediently and accurately.
【Fund】: 国家自然科学基金资助项目(50475132)
【CateGory Index】: TG501
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