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《China Mechanical Engineering》 2009-14
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Prediction and Measurement of Subsurface Damage Thickness of Silicon Wafer in Wire Saw Slicing

Gao Yufei Ge Peiqi Li Shaojie Hou Zhijian Shandong University,Jinan,250061  
An abrasive machining in wire sawing process was considered as moving indention subjected to normal force and tangential force.Based on indentation fracture mechanics theory,the calculation formula of median crack propagation length was analyzed by synthetically considering the contributions of elastic stress field and residual stress field beneath the abrasive.The depth of median crack propagation layer was postulated as equal as to the subsurface damage layer thickness(dSSD),and the lateral crack depth was equal to the surface roughness Rz,thereby a theoretical model of relationship between dSSD and Rz was founded for predicting the dSSD.Moreover,a bonded interface sectioning technique with scanning electron microscope(SEM) was employed to measure the silicon dSSD.The results indicate that the experimental measurement values coincide with the theoretical prediction ones comparatively.The theoretical model can be used for predicting dSSD rapidly,expediently and accurately.
【Fund】: 国家自然科学基金资助项目(50475132)
【CateGory Index】: TG501
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【Citations】
Chinese Journal Full-text Database 4 Hits
1 FAN Rui xin, HU Huan ming (State Key Laboratory of Silicon Material,Zhejiang University,Hangzhou, 310027,China);Study on Surface Damage in Line cutting Silicon[J];MATERIALS SCIENCE AND ENGINEERING;1999-02
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【Co-citations】
Chinese Journal Full-text Database 10 Hits
1 ZHANG Liao-yuan~(1,2),JIA Chun-de~2,LU Yu-shan~2(1.Changchun Univercity of Science and Technology,Changchun 130022,Jilin,China;2.Shenyang Ligong University,Shenyang 110168,Liaoning,China);A Machining Method on Electroplated Diamond Wire Saw with Ultrasonic Vibration[J];Acta Armamentarii;2006-05
2 JIN Yong-ji (The 45th Research Institute of CETC, BeijingEast Yanjiao 101601,China);The Study of Invalidation Mechanism in the Process of Multi-wire Sawing[J];Equipment for Electronic Products Manufacturing;2006-11
3 Meng Jianfeng Li Jianfeng Meng Lei;Study on Cutting Mechanism of Hard and Brittle MaterialsBeing Sawed and Grinded[J];Tool Engineering;2004-04
4 Ge Peiqi Meng Jianfeng Chen Juhua et al;Precision Slicing Technology for Single Crystal Silicon and Relative Basic Research[J];Tool Engineering;2005-09
5 ZHENG Jianxin, XU Jiawen, LV Zhengbing (College of Mechanical and Electronic Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China);GRINDING MECHANISM OF CERAMICS IN THE DUCTILE REGIME[J];Journal of the Chinese Ceramic Society;2006-01
6 LIU Lixin1,LUO Ping1,LI Chun1,LIN Hai1,ZHANG Xuejian1,2,ZHANG Ying1(1.Changchun University of Science and Technology,Changchun 130022;2.Jilin Architectural and civil Engineering institute,Changchun 130021);Growth Principle and Technique of Single Crystal Silicon[J];Journal of Changchun University of Science and Technology(Natural Science Edition);2009-04
7 ZHANG Ke-hua1,2,WEN Dong-hui1,HONG Tao1,et al(1.MOE Key Laboratory of Mechanical Manufacture and Automation,College of Mechanical & Electrical Engineering,Zhejiang University of Technology,Hangzhou 310014 2.Institute of Machinery Equipment and Measurement & Control Technology,Jinhua 321004);Nanoindentation Experiment and Finite Element Simulation for Sapphire[J];Aviation Precision Manufacturing Technology;2009-02
8 HOU Zhijian~(1,2),GE Peiqi~1,GAO Yufei~1(1.School of Mechanical Engineering,Shandong University,Jinan Shandong 250014,China;2.School of Mechanical Engineering,Jinan University,Jinan Shandong 250022,China);The Design of a Wire Saw with Rocking Mechanism[J];Machine Tool & Hydraulics;2006-07
9 WANG Chaoqun,KANG Min(Engineering College,Nanjing Agricultural University,Nanjing 210031,China);Study on Modeling of Material-removal-rate in Ultrasonic Machining and Experiments[J];Machine Tool & Hydraulics;2006-12
10 Xie Zhenhua Wei Xin Huang Ruiwei Xiong Wei ( Faculty of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510090, China);SEMICONDUCTOR WAFER SLICING WITH DIAMOND TOOLS[J];Diamond & Abrasives Engineering;2004-01
【Secondary Citations】
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1 FAN Rui xin, HU Huan ming (State Key Laboratory of Silicon Material,Zhejiang University,Hangzhou, 310027,China);Study on Surface Damage in Line cutting Silicon[J];MATERIALS SCIENCE AND ENGINEERING;1999-02
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