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《China Mechanical Engineering》 2015-06
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Analysis and Numerical Simulation of Film Thickness of Photoresist Spin Coating

Liu Xueping;Zheng Gang;Graduate School of Tsinghua University at Shenzhen;Tsinghua University;  
The spin coating method was an important method for photoresist coating in the photolithography process. Based on the mode of the classical EBP equation and solvent evaporation mode which considered the relationship between the solvent evaporation and spin speed,and the dynamic parameter compensation was added through the numerical simulation of the transition point to get a further modified equation. The validity of the modified equation was verified by the experimental data collected by the lab made spin coating device.More reasonable process parameters can be obtained with this optimized fitting method.
【Fund】: 国家科技重大专项(2012ZX02102)
【CateGory Index】: TN305.7
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【Citations】
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【Co-citations】
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