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《China Mechanical Engineering》 2016-19
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Analyses of Processing Parameters of BGA Solder Joint Based on Yield of Self-assembly

Chen Yilong;Jia Jianyuan;Fu Hongzhi;Zhu Zhaofei;Xidian University,Xi'an, 710071;ZTE Corporation;  
The influences of the deviation rates of volume of the solder joints and diameters of pads on the yield of self-assembly were studied to improve the yield of BGA components.Considering the thermal warpage,the unavoidable deviations in the manufacture of the volume of solder joints and the randomness of the positions of solder joints,the processes of self-assembly were discussed.The stand-off curves of solder joints with different volumes were obtained according to solving the shapes of solder joints.Based on the stand-off curves of solder joints,the influences of the deviation rates of volumes of the solder joints and diameters of pads on the yield of self-assembly were simulated.The common range of the stand-off curves of solder joints and the yield are increasing with the decreasing of the deviation rates of volumes of the solder joints and diameters of pads.
【Fund】: 国家自然科学基金资助项目(61201021)
【CateGory Index】: TN405
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1 CHEN Yi-long1,JIA Jian-yuan1,FU Hong-zhi2,WANG Shi-yu2(1.Xidian University,Xi’an 710071,China;2.ZTE Corporation,Shenzhen 518057,China);Analysis of Warpage of Chip Based on Lamination Theory[J];电子工艺技术;2012-06
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