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《Modular Machine Tool & Automatic Manufacturing Technique》 2011-01
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Development for One Kind of CMP Trial Device

YU Sheng-li,JI Fang,CHEN Dong-sheng(China Academy of Engineering Physics,Institute of Mechanical Manufacturing Technology,Mianyang Sichuan 620019,China)  
It is very difficult that hard brittle materials reach sub-micron planar degree and nanoscale roughness by mechanical processing.Chemical machinery polishing widely used in the field of IC processing can achieve precision machining requirements of the workpiece.Therefore,a high-precision CMP test device is designed,this device cmplete man-machine dialogue with touch screen,PLC as the core control,digital and analog signal acquisition and the control of actuators through the interface,the characteristics of the device is structure compact and easy control.In this device process the stainless steel workpiece of Φ100mm,planar degree and roughness meet or exceed the design requirement
【Fund】: 中国工程物理研究院科学技术发展基金资助(2008B0203016)
【CateGory Index】: TG175
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