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Journal of Shanghai Jiaotong University
FQ: monthly
AD of Publication: China
Lanuage: English
ISSN: 1006-2467
CN: 31-1466/U
YP: 1956
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Journal of Shanghai Jiaotong University
2007 -S2
Catalog
The Formation of Nickel Nanocone Array Material by Directional Electrodepositing Method HANG Tao,FEI Qin,LI Ming,LING Hui-qin,MAO Da-li(School of Materials Science and Eng.,Shanghai Jiaotong Univ.,Shanghai 200030, China)
The Role of Surface Electroplated Cu on Oxidation Failure of Lead Frame for IC Package WANG Shou-shan,HU An-min,LI Ming,SHEN Hong,MAO Da-li(State Key Lab.of Metal Matrix Composites,School of Materials Scienceand Eng.,Shanghai Jiaotong Univ.,Shanghai 200030,China)
Study on the Mechanism of Water Absorption of SiOC Low-κ Dielectrics SUN Liang,ZHU Lian,XUE Yuan,DING Shi-jin,ZHANG Wei(Dept.of Microelectronics,Fudan-Novellus Interconnect Research Center,Fudan Univ.,Shanghai 200433,China)
Fabrication of Low Stress Ni-W Nanocrystalline for MEMS Devices WANG Hong,DING Gui-fu,ZHAO Xiao-lin,YAO Jin-yuan,ZHU Jun,WANG Zhi-min(Research Inst.of Micro /Nano Science and Technology;Key Lab.for Thin Film and Microfabrication Technology of Ministry of Education;National Key Lab.of Micro/Nano Fabrication Technology,Shanghai Jiaotong Univ.,Shanghai 200030,China)
3.43 GHz Power Amplifier Design by SiGe BiCMOS Process ZHOU Jian-chong,LI Zhi-qun,FAN Hai-juan,WANG Zhi-gong(Inst.of RF-& OE-ICs,Southeast Univ.,Nanjing 210096,China)
A Large Current Charge-Pump with Invariable Current and Good Current Matching XUE Ke,FENG Jun(Inst.of RF-& OE-ICs,Southeast Univ.,Nanjing 210096,China)
Design of 1.5 V 3.2 Gb/s Demultiplexer in 0.35 μm CMOS Process QIU Ling,FENG Jun(Inst.of RF-& OE-ICs,Southeast Univ.,Nanjing 210096,China)
Analysis and Design of Rectifier on Passive RFID Transponders JIANG Fan~(1,3),GUO Dong-hui~(1,2,3)(1.EDA Lab,Dept.of Physics,Xiamen Univ.,Xiamen 361005,China;2.Dept.of Electronic Eng.,Xiamen Univ.,Xiamen 361005,China;3.Xiamen Rich IT Microelectronic Technologies LTD,Xiamen 361005,China)
Switch-Line Phase Shifter with RF-MEMS Switch CHEN Hua-jun~a,GUO Dong-hui~(a,b)(a.EDA Lab.,Dept.of Physics;b.Dept.of Electronic Eng.,Xiamen Univ.,Xiamen 361005,China)
Multilevel Silicide Interconnect in Monolithic Microsensors HU Bin,RUAN Ai-wu,LI Ping,ZHAI Ya-hong,CAI Dao-lin(Key Lab.of Electronic Thin Films and Integrated Devices,Univ.of Electronic Science andTechnology of China,Chengdu 610054,China)
The Post-Simulation Technique According to the High-Speed Electric Circuit Based on Chip Class LAI Xin-quan,DAI Guo-ding,ZANG Ming-xiang,YUE Jian-guo,LI Xian-rui(Xidian Univ.,Xi'an 710071,China)
Additional Polishing Process and the Pin-Up Speed Optimization for the Prevention of Linear Crack of BOC Chip ZHU Jia-qi,LI Qun,FENG Jian-qingMENG Zhong,LEE Jeongsam(Samsung Electronics(Suzhou) Semiconductor Co.Ltd.,Suzhou 215021,China)
Recent Advance in Cooling Techniques for CPU GAO Xiang,LING Hui-qin,LI Ming,MAO Da-li(The State Key Lab.of the Metal Matrix Composites,Shanghai Jiaotong Univ.,Shanghai 200030,China)
The Current Status and Trends in Research on Soldering Flux for Lead-free Solder in Electronic Assembly XU Dong-xia,LEI Yong-ping,XIA Zhi-dong,GUO Fu,SHI Yao-wu(College of Materials Science and Eng.,Beijing Univ.of Technology,Beijing 100022,China)
Electro Magnetic Compatibility(EMC) Research on Mixed-Multilayer Substrate XU Hai-feng,XIE Kuo-jun,ZHU Lin,YANG Xian-wei(School of Physical Electronics,Univ.of Electronic Science and Technology of China,Chengdu 610054,China)
The Whisker Formation on Pure Sn Coating of Leadframe under Temperature Cycling Condition ZHANG Jin-song,WU Yi-ping,ZHU Yu-chun,LI Juan-juan,WU Feng-shun,AN Bing(1.Huazhong Univ.of Science and Technology,Wuhan 430074,China;2.Wuhan National Lab.for Optoelectronics,Wuhan 430074,China)
Growth of IMC in SnAgCu/Cu Butt Solder Joint During Thermal Aging LI Feng-hui,LI Xiao-yan,YAN Yong-chang(College of Materials Science and Eng.,Beijing Univ.of Technology,Beijing 100022,China)
The Interfacial Reactions and Realibility with Lead(Pb)-Free Solders JIANG Yan-feng,ZHANG Xiao-bo(Microelectronic Center,North China Univ.of Technology,Beijing 100041,China)
Examination of the Assembling Accuracy of Polarization-Maintaining Dual Fiber by Computer Sight QIU Jian-xin~1,ZHONG Ping~2(1.School of Mechanical Eng.,Shanghai Univ.of Eng.Science,Shanghai 201620,China;2.College of Science,Donghua Univ.,Shanghai 201620,China)
Preparation of Dope for Shielding Electromagnetic Interference(EMI) with Temperature and Humidity Resistance Properties BAI Tian,ZHANG Zhi-sheng,WANG Xiu-yu(School of Electronics and Information Eng.,Tianjin Univ.,Tianjin 300072,China)
The Viscoplasticity and Void Damage Behaviors of SnAgCu Solder Alloy ZHOU Jun,HAO Wei-na,CHAI Guo-zhong(The Ministry of Education Key Lab.of Mechanical Manufacture and Automation,Zhejiang Univ.of Technology,Hangzhou 310014,China)
Study on Improving the Joint Quality of Reflow Soldering for Large Dimension Copper-Clad Laminates LI Xiao-xia,ZHU Rong-lin(813 Inst.,Shanghai Astronaustics Bureau,Shanghai 200086,China)
The Design for Manufacture Analysis Based on Printed Circuit Board HUANG Zhan-wu,LI Zhi-juan,JIANG Jian-guo,YE Qiang,CAO Yu(Xidian Univ.,Xi'an 710071,China)
Effect of Lead-Free Soldering Technology on the Reliability of PCB LI Xiao-xia,ZHU Rong-lin(813 Inst.,Shanghai Astronaustics Bureau,Shanghai 200086,China)
CALPHAD Method and Its Applications in Pb-Free Solders GAO Feng,WANG Cui-ping,LIU Xing-jun(Dept.of Materials Science and Eng.,Xiamen Univ.,Xiamen 361005,China)
Effect of Temperature,Moisture and Vapor Pressure on Delamination in a PBGA During Reflow Soldering Process SU Xi-ran,YANG Dao-guo,ZHU Lan-fen,KANG Xue-jing(College of Mechanical & Electrical Eng.,Guilin Univ.of Electronic Technology,Guilin 541004,China)
The thermal Distortion Simulation of Lead Free PCB Assembly During Reflow Soldering Process ZHOU Bin,PAN Kai-lin,YAN Yi-lin(Inst.of Mechatronics Eng.,Guilin Univ.of Electronic Technology,Guilin 541004,China)
EU RoHS Directive Compliance Operation Guidance PAN Kai-lin~1,ZHAO Xiao-yun~2,YAN Yi-lin~1,ZHOU Bin~1(1.Inst.of Mechatronics Eng.,Guilin Univ.of Electronic Technology,Guilin 541004,China;2.Xinfei Electric Co,Ltd,Xinxiang 453002,China)
The Copper-Diffusion Induced Failure of Lead-Free Solder Joints LUO Dao-jun,ZOU Ya-bing(China Ceprei Lab.,Guangzhou 510610,China)
Application and Development of LTCC for RFIC LIU Lin-tao,WANG Jin-xiang,YU Ming-yan(Microelectronics Center,Harbin Institute of Technology,Harbin 150001,China)
Preparation of Electrically Conductive Filler for Anisotropic Conductive Adhesive HUA Li~1,2,AN Bing~1,2,WU Yi-ping~1,2WU Feng-shun~1,2,WANG Jia~1,HE Jing-qiang~1(1.State Key Lab.of Material Processing and Die & Mould Technology,Huazhong Univ.of Science & Technology,Wuhan 430074,China;2.Wuhan National Lab.for Optoelectronics,Wuhan 430074,China)
The Study of SMT Product Manufacturing Grid System LI Chun-quan~1,YU Tao~2(1.Dept.of Electronic Machinery and Traffic Eng.,Guilin Univ.of Electronic Technology,Guilin 541004,China;2.CIMS Center,Shanghai Univ.,Shanghai 210072,China)
Thermal-Mechanical Simulation and Analysis on Structural Caused Package Induced Stress in Stacked Chip Scale Package QIAN Feng,CHENG Xiu-lan,LIU En-feng(School of Microelectronic,Shanghai Jiaotong Univ.,Shanghai 200030,China)
Properties of the Environmental-Friendly Si/Al Composite for Electronic Packages Fabricated by Squeeze Casting Technology WU Gao-hui,XIU Zi-yang,ZHANG Qiang(School of Materials Science and Eng.,Harbin Institute of Technology,Harbin 150001,China)
Study on MCM Interconnect Test Generation Based on Ant Algorithm with Mutation Operator CHEN Lei(Dept.of Computer Science,Guilin Univ.of Electronic Technology,Guilin 541004,China)
Reliability Analysis of Sn-Bi Plating Chips SHUAI Di,JIN Xing,GUO Shi-da,YU Kwangsu(Samsung Electronics(Suzhou) Semiconductor Co.Ltd.,Suzhou 215021,China)
2007 Issues:  [S2] [S1] [12] [11] [10] [09] [08] [07] [06] [05] [04] [03] [02] [01]
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