Home|Journal Papers|About CNKI|User Service|FAQ|Contact Us|中文
Full-Text Search:
Packaging Engineering
FQ: 半月
AD of Publication: 重庆市
Lanuage: 中文;
ISSN: 1001-3563
CN: 50-1094/TB
YP: 1979
Url: 中国兵器工业第五九研究所
Recommended Journals
Packaging Engineering
1999 -01
Industrial Design and Product Packaging Changzhou Normal College of Technology Cheng Yuhua Changzhou Institute of Plastics Packaging Wang Zhanyao
The Shock Response of Nonlinear Packaging System under the Action of Final Peak Saw Smooth Pulse Wuxi University of Light Industry Wu Dongyan Wang Zhiwei
Particle Board/Al/Epoxy Laminate Analysis of Mechanical Property Kunming Universtity of Science and Technology Zhou zhao Tang Peizhao Li Xiaolin Kunming Particle Board Factory Rui Bingquan
Application Research on the G m σ s Curves Xi'an University of Technology Guo Yanfeng Xu Wencai Zhi Wenguang
Deoxy Package Principle and its Application in Food Industry Hangzhou Institute of Commerce Lin Jialian
Printing Research of Corrngated Carton Wuhan Technical University of Surverying and Mapping Ke Xianwen Zhao Jianjun
The Application of Electromagnetic Shielding Material in Package of Rockets Ordnance Engineering College Yu Xin Fu Xiaozhong Du Shiguo
On the Interreaction between Package and Environment Nanchang University Huang Huiqin
1999 Issues:  [01] [02] [03] [04] [05] [06]
More Issues:   [1988]   [1989]   [1990]   [1991]   [1992]   [1993]   [1994]   [1995]   [1996]   [1997]   [1998]   [2000]   [2001]   [2002]   [2003]   [2004]   [2005]   [2006]   [2007]   [2008]   [2009]   [2010]   [2011]   [2012]   [2013]   [2014]   [2015]   [2016]   [2017]   [2019]
©2006 Tsinghua Tongfang Knowledge Network Technology Co., Ltd.(Beijing)(TTKN) All rights reserved