Home|Journal Papers|About CNKI|User Service|FAQ|Contact Us|中文
Full-Text Search:
Semiconductor Technology
FQ: 月刊
AD of Publication: 河北省石家庄市
Lanuage: 中文;
ISSN: 1003-353X
CN: 13-1109/TN
YP: 1976
Url: 中国半导体行业协会;半导体专业情报网;中国电子科技集团公司第十三所
Recommended Journals
Semiconductor Technology
2004 -06
Catalog
The progress of electromigration in bump interconnect WU Feng-shun1,2 ZHANG Jin-song1,WU Yi-ping1,2,WANG Lei1(1. State Key Laboratory of Plastic Forming Simulation & Die Technology,HuaZhong University of Science & Technology, Wuhan, 430074 China;2.Institute of Microsystems, HuaZhong University of Science and Technology, Wuhan, 430074 China)
Application and research of endpoint-detection technology for chemical mechanical polishing of large size wafer LUO Yu-qing,KANG Ren-ke,GUO Dong-ming,JIN Zhu-ji(School of Mechanical Engineering,University of Dalian Technology,Dalian 116024,China)
Design and manufacture of 63.5mm×127mm UT 1X reticle SU Peng-yi1,2, CHEN Kai-sheng1, CAO Zhuang-qi1(1. Shanghai Optical Lithography Electronic Engineering Co. Shanghai, 200233, China; 2. Shanghai Jiao Tong University, Shanghai 200030, China)
Multichip module technology ZENG Yun,YAN Min,WEI Xiao-yun (Microelectronic Institute, Hunan University, Changsha 410082,China)
Design of 1550nm SFF optic-transceiver and analyze of noise characteristic on MC2045 QI Yan,CHEN Wei,WANG Gui-qiong(Information Engineering College, Wuhan University of Technology, Wuhan 430070, China)
Study on Pudong Fabless-Foundry interaction development DING Wei1, QIAN Xing-san1, XUE Zi2, LIN Jing1,2, XU Guo-chang2(1. Institute of Microelectrics Development, University of Shanghai for Science & Technology, Shanghai200093, China; 2. Shanghai Integrated Circuit Association, Shanghai 201203, China)
The measures of new technology & development in IC industrial chain CHENG Li1, LI Chun-ming2,WANG Zhen-yu1, GAO Ping1(Institute of Electricity & Information, Jiangsu University, Zhenjiang 212013, China)
SOC design and test TAN Ying-li1 RONG Meng-tian2(1.Shanghai Belling R&D,Shanghai 200233, China;2. Shanghai JiaoTong University,Shanghai 200030, China)
Efficient coupled noise estimation for SOC interconnects ZHANG Jin-lin1,SHEN Xu-bang1,2,CHEN Chao-yang1(1.Key Lab of Education Ministry, Institute of Image Recognition and Artificial Intelligence, HuazhongUniversity of Science and Technology, Wuhan 430074,China; 2. Xi'an Microelectronic Technology Institute,Xi'an 710054, China)
Experimental study of breakdown characteristic of thin dielectric film in nanometre range formed by low temperature PECVD CHEN Pu-sheng1, LIU Jian2, ZHANG Hao3, FENG Wen-xiu1(1.Dept of Appl Phys, South China University of Tech, Guangzhou 510640 China; 2.Scientific Institute of Postsand Telecommunications of Guangdong Province,Guangzhou 510665 China;3.The 5th Institute,CE TC, Guangzhou 510610,China)
Development on oxygen precipitation in heavily-doped Si ZHANG Hong-di, LIU Cai-chi(Institute of Semiconductors, Hebei University of Technology, Tianjin 300130,China)
A new adaptive SSO noise suppressing output buffer CHEN Yong-cong(VIA Technology Inc. (China) Mixed-Signal Design Group,Beijing 100085, China)
Introduction of spectral band replication LU Yang(Southeast University nanjing 210096 China)
2004 Issues:  [01] [02] [03] [04] [05] [06] [07] [08] [09] [10] [11] [12]
More Issues:   [1997]   [1998]   [1999]   [2000]   [2001]   [2002]   [2003]   [2005]   [2006]   [2007]   [2008]   [2009]   [2010]   [2011]   [2012]   [2013]   [2014]   [2015]   [2016]   [2017]   [2018]   [2019]
©2006 Tsinghua Tongfang Knowledge Network Technology Co., Ltd.(Beijing)(TTKN) All rights reserved