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Micronanoelectronic Technology
FQ: 月刊
AD of Publication: 河北省石家庄市
Lanuage: 中文;
ISSN: 1671-4776
CN: 13-1314/TN
YP: 1964
Url: 中国电子科技集团公司第十三研究所
Recommended Journals
Micronanoelectronic Technology
2004 -12
Catalog
Zero dimensional and one dimensional semiconducting nanostructures WAN Qing1,2,FENG Ping1,WANG Tai-hong1(1.Institute of physics,Chinese Academy of Sciences,Beijing 100081,China;2.Shanghai Institute of Microsystem and Information Technology,Shanghai 200050,C hina)
Investigation on GaN-based semiconductor optoelectronic material and device NIU Ping-juan1,CHEN Nai-jin1,LI Yang-xian2,GUO Wei-lian3(1.School of Information and Communication,Tianjin Polytechnic University,Tianji n 300160,China;2.Material School,Hebei University of Technology,Tianjin 300130,China;3.School of Electronic Information Eng,Tianjin University,Tianjin 300072,China)
PCR chip and micro total analysis systems ZHUANG Gui-sheng,ZHAO Jian-long(Shanghai Institute of Microsystem and Information Technology,Shanghai 200050,Ch ina)
Development of the preparation of ZnO quantum dots and their optical-electrical properties YANG Ling-min,YE Zhi-zhen(State Key Laboratory of Silicon Material,Zhejiang University,Hangzhou 310027,Ch ina)
Fabrication and application of InN films XIE Zi-li,ZHANG Rong,BI Zhao-xia,LIU Bin,XIU Xiang-qian,GU Shu-lin,JIANG Ruo-lian,HAN Ping,ZHU Shun-ming,SHEN Bo,SHI Yi,ZHENG You-dou(Jiangsu Provincial Key Laboratory of Photonic and Electronic Materials Science and Technology,Department of Physics,Nanjing University,Nanjing 210093,China)
Research on a new type of micro-device packaging technology HUANGFU Yong,WANG Xiao-peng,CHEN Hua-ling(College of Mechanical Engineering,Xian Jiaotong University,Xian 710049,Chin a)
The defect distribution of bonded wafers and its relationship to the Weibull modulus XIAO Ying-ying1,2,HUANG Qing-an1,WANG Jian-hua2(1.Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing 210096,China;2.School of Science,Hefei University of Technology,Hefei 230009,China)
A miniature electric field sensor using vibrating polyimide film GONG Chao1,2,XIA Shan-hong1,DENG Kai1,2,BAI Qiang1,CHEN Shao-feng1(1.State Key Lab of Transducer Technology,Institute of Electronics,Chinese Acade my of Sciences,Beijing 100080,China;2.Graduate School of the Chinese Academy of Sciences,Beijing 100039,China)
VDSM interconnect characteristics and the place and route optimization XUE Zhen-hua,LI Hui-jun(School of Inform.Sci.& Eng.,Shandong Univ.,Jinan 250100,China)
Theoretical computation on the shape changing displacement of AFM microcantilever SU Jing-yun(The College of Mechanical Engineering,Yanshan University,Qinhuangdao 066004,Chi na)
2004 Issues:  [01] [02] [03] [04] [05] [06] [07] [08] [09] [10] [11] [12]
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