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Micronanoelectronic Technology
FQ: monthly
AD of Publication: China
Lanuage: Chinese
ISSN: 1671-4776
CN: 13-1314/TN
YP: 1964
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Micronanoelectronic Technology
2015 -01
Catalog
Chaotic Dynamical Analysis of Josephson-Circuit-Coupled Quantum Cellular Neural Network Wang Sen;Cai Li;Zhang Bin;Yang Xiaokuo;Feng Chaowen;The Science Institute
Error Analysis and Test on the Secondary Integration of the MEMS Bionic Vector Hydrophone Liu Yuan;Wang Lijuan;Zhao Peng;Shen Hui;Zhao Long;Zhang Guojun;Key Laboratory of Instrumentation Science & Dynamic Measurement of Ministry of Education
Defect Feature on the Band Gap of the One-Dimensional Photonic Crystal with the Single Center-Doped Defect Layer Cai Yungao;Fang Xing;Dong Yinghong;Faculty of Science and Technology
Effects of Doped ZnO Thick Films on Acetone Gas Sensing Properties Bai Weiqin;Pan Guofeng;Liu Mengmeng;Tian Ye;School of Information Engineering
Synthesis and Optical Properties of the PbS QD-MWCNT Heterostructure Material Lu Dejiong;Li Xiaolin;Hu Nantao;Shen Yong;Wei Liangming;Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education
New Developments of the Typical MEMS and Wearable Sensor Technologies Zhao Zhengping;China Electronics Technology Group Corporation;Science and Technology on ASIC Laboratory;
A Bi-Stable Electromagnetic MEMS Switch Li Huijuan;Sun Jian;Yang Zijian;Hao Changling;Yu Jifang;Beijing Aerospace Micromechanical Electronics Technology Institute;
Application of S/TiO_2 Nanocomposite in the Lithium-Sulphur Battery Hu Changchen;Wei Liangming;Li Xiaolin;Lu Dejiong;Key Laboratory for Thin Film and Microfabrication of Ministry of Education
Rapid and Uniform Etching of SiC Materials by NLD Zhang Wei;Sun Yuanping;Liu Bin;Institute of Opto-Electronic Information Science and Technology
ICP-RIE Dry Etching of 4H-SiC Materials in SF_6/O_2/HBr Wang Jinze;Yang Xiang;Niu Yingxi;Yang Fei;He Zhi;Liu Shengbei;Yan Wei;Liu Min;Wang Xiaodong;Yang Fuhua;Research Center of Semiconductor Integration Technology
A Cleaning Agent for Effectively Removing CuO Particles on the Copper Surface After the CMP Yang Zhixin;Gao Baohong;Wang Chenwei;Sun Ming;Sun Mingbin;Zhang Nannan;Cheng Chuan;Tan Baimei;Institute of Microelectronics
2015 Issues:  [01] [02] [03] [04] [05] [06] [07] [09] [10] [11] [12]
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