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Electronics & Packaging
FQ: 月刊
AD of Publication: 江苏省无锡市
Lanuage: 中文;
ISSN: 1681-1070
CN: 32-1709/TN
YP: 2002
Url: 中国电子科技集团公司第五十八研究所
Recommended Journals
Electronics & Packaging
2018 -02
A Way for Testing Watch Dog Timeout Period WANG Zhengyu;ZHANG Shaoyun;China Electronics Technology Group Corporation No.58 Research Institute;Jiangnan Computer Technology Research Institute;
Research of Passive Inter-Modulation Testing Using Sharing Platform XIA Yongping;WEI Bin;XIE Yayun;China Electronics Technology Group Corporation No.58 Research Institute;
DDS Based on Improved Scaling-Free CORDIC Algorithm YANG Qiang;GAO Bo;GONG Min;Sichuan Key Lab of Microelectronics Technology
Research of Math Module of Switch Matrixin FPGA LIU Peiwen;FU Yuzhuo;DONG Yiping;School of Microelectronics
The Design and Implementation for Low Power Mode on SoC SHI Xingqiang;FAN Xueshi;China Key System Co
The LIGBT and PLDMOS with Shared Buffer ZHANG Enyang;HUANG Yong;MENG Lingfeng;DAI Gaoqiang;ChangHong Electric Co.
The Flip Chip Bonded Technology in Surface Acoustic Wave Components in Production of the Application MA Jie;China Electronics Technology Group Corporation No.55 Research Institute;
High Density Stacked Adaptive Packaging Technology Based on Micro Solder Ball QIU Zhao;Southwest China Institute of Electronic Technology;
Development and Perspective of IGBT Structural Design LI Bishan;WANG Zhao;DONG Ni;CRRC Yongji Electric Co.Ltd.;
Design and Implementation of HD-SDI to HDMI Interface Based on FPGA FU Qiang;YANG Wenhao;NI Wenlong;China Electronics Technology Group Corporation No.58 Research Institute;
A Design of SIN/COS Multiplication on the Basic of the Resolver Control System LIU Taiguang;ZHU Xiaoyu;MIAO Yun;China Electronic Technlogy Group Corporation No.58 Research Institute;
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