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Electronics & Packaging
FQ: 月刊
AD of Publication: 江苏省无锡市
Lanuage: 中文;
ISSN: 1681-1070
CN: 32-1709/TN
YP: 2002
Url: 中国电子科技集团公司第五十八研究所
Recommended Journals
Electronics & Packaging
2018 -03
Catalog
The Behavior of Underfill Adhesive on the Different Treatment Ceramic Package LI Jingxuan;LIU Pei;LIAN Binhao;LIN Pengrong;HUANG Yingzhuo;Beijing Microelectronics Technology Institution;China Academy of Aerospace Standardization and Product Assurance;
Research on Multi-Heads Automatic Sorting Machine LIU Zhenglong;Tongling Sanjia Yamada TECH.CO.
Research on Full Automatic IC Braiding and Dismantling Machine WANG Lulu;LI Wenbin;China Electronics Technology Group Corporation No.58 Research Institute;
Research on FPGA DC Parameter Compensation Test Method Based on UltraFlex System CHEN Cheng;CHEN Long;XIAO Yanmei;China Electronics Technology Group Corporation No.58 Research Institute;College of Internet of Things
A Low-power 8-bit 300 MS/s Asynchronous SAR ADC QIAN Zheng;ZHAO Xin;GONG Min;GAO Bo;TAN Ping;WANG Pengyu;College of Physical Science and Technology
High Speed Fiber-optic Transmission Card Based on FPGA ZHU Chen;CUI Lei;SHAO Chunwei;WANG Xiaolong;China Electronics Technology Group Corporation No.58 Research Institute;
A Design of Configure Chip Based on SRAM-type FPGA ZHUANG Xueya;LI leilei;China Electronics Technology Group Corporation No.58 Research Institute;
A Combination Algorithm for FPGA Placement WANG Xinchen;XU Hui;YU Jian;HUI Feng;China Electronics Technology Group Corporation No.58 Research Institute;East Technologies Inc.;
Poly Surface Pre-clean for Parasitic Resistance Reduction in 0.13 μm Embedded Flash ZHAO Jiang;GU Peilou;ZHANG Lei;CHEN Jue;XI Shengrong;Shanghai Huahong Grace Semiconductor Manufacturing Corporation;School of Electronics Information and Electrical Engineering
Leakage Failure Improvement of 0.8 μm High Voltage BCD Circuits XIANG Lu;CHEN Honglei;SU Lanjuan;Hangzhou Silan Integrated Circuits Co.Ltd.;
Application of Second-hand Equipment in the IC Industry MA Huihong;TANG Siyu;China Electronics Technology Group Corporation No.58 Research Institute;
Design of a Multi-channel Transmitting and Receiving Module for a Dual-mode Navigation System XIA Yongping;WEI Bin;SUN Miao;China Electronics Technology Group Corporation No.58 Research Institute;
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