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Electronics & Packaging
FQ: 月刊
AD of Publication: 江苏省无锡市
Lanuage: 中文;
ISSN: 1681-1070
CN: 32-1709/TN
YP: 2002
Url: 中国电子科技集团公司第五十八研究所
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Electronics & Packaging
2019 -04
Uncertainty Analysis of Fault Prediction for DC-DC Power Module Based on Bayesian Network JIA Xiaoxiao;GAO Huizhuang;HUANG Jiaoying;Military Delegate Office of PLA Rocket Force at Fact.699;School of Reliability and Systems Engineering
Wideband Filtering Patch Antenna with Low Cross-Polarized Level ZHANG Cheng;MAO Zhen;YANG Bing;DING Taojie;China Electronics Technology Group Corporation No.58 Research Institute;
Poor Packing Analysis and Improvement Measures of Power Device Package LI Minghuan;Tianshui Huatian Electronics Group;
SOP 8 Delamination Exploration and Solution LI Jin;ZHU Hao;Eternal Electronic Materials Co.
The Design of Efficient Isolator CMTI Test System LI Huan;GU Xiaoming;China Electronics Technology Group Corporation No.58 Research Institute;
Design of a High Speed and High Accuracy Class-AB Fully Differential Operational Amplifier ZHANG Zhen;WANG Xueyuan;FENG Yi;China Electronics Technology Group Corporation No.58 Research Institute;
Design of 500 V Enhancement and Depletion Integrated VDMOS Devices LI Xuehui;HUANG Changmin;ZHAN Xiaoyong;XU Yuhuan;Wuxi Changde Microelectronic Co.
The Warpage Study of Ultra-Thin Die Stack FPBGA Package YANG Jianwei;RAO Xilin;Guangdong Chippacking technology Ltd.;Shenzhen Chippacking technology Co.Ltd.;
A Design of Oscillator for OLED Drive Circuit CHENG Liang;ZHAO Zilong;Shanxi Institute of Economic Management;School of Civil Engineering
Analysis on the Design of an Improved MLSCR-ESD LIU Mingfeng;XU Shengyang;I-CORE Electronics Co.;
The Technique of Single Event Effect Simulation Uses TCAD and SPICE ZHOU Xinjie;CHEN Yao;HUA Zhengyong;YIN Ya'nan;GUO Gang;CAI Li;China Electronics Technology Group Corporation No.58 Research Institute;Innovative Center of Radiation Hardening Applied Technology
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