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Electronics & Packaging
FQ: 月刊
AD of Publication: 江苏省无锡市
Lanuage: 中文;
ISSN: 1681-1070
CN: 32-1709/TN
YP: 2002
Url: 中国电子科技集团公司第五十八研究所
Recommended Journals
Electronics & Packaging
2001 -01
Catalog
Effects of Surface Characteristics on the Bondability of PBGA Soft Gold Wire Bond Pads YANG Jian-sheng XU Yuan-bin (Technical Department,Yonhong Electronic Equipment and Materials Plant,Tianshui,Gansu 741000,China)
2001 Issues:  [01] [02]
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