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Electronics & Packaging
FQ: monthly
AD of Publication: China
Lanuage: English
ISSN: 1681-1070
CN: 32-1709/TN
YP: 2002
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2001 -02
Catalog
The New Trend of Microelectronics Packaging Technology LI Xiu-qing
Comprehensive Comparison Between FC and CSP and Their Development Anticipation YANG Jian-sheng
Technology Review:Wafer-level Packaging FU Zheng-wei
2001 Issues:  [02] [01]
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