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Electronic Components and Materials
FQ: monthly
AD of Publication: China
Lanuage: English
ISSN: 1001-2028
CN: 51-1241/TN
YP: 1982
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Electronic Components and Materials
2001 -06
Catalog
Effect of Different Si-Al Wires on Bond Heel Cracks LI Zi-xue
Preparation of Substrates with High Thermal Conductivity by Hydro-thermal Method REN Chen-xiao
Effect of Polymeric Inhibitor on DC Etching of Anodic Aluminum Foil for High Voltage Capacitors YAN Kang-ping1
Technology for Thick Film ICs on Stainless Steel Substrates ZHANG Wei-jun
Study on Mechanism of Electrochemical Corrosion of Al-foil for Aluminum Electrolytic Capacitor Anode FENG Zhe-sheng 1
Thin-film Metalization on LTCC Substrates WU Shen-li
Effect of Rare Earth Oxide Er_2O_3 on Dielectric Properties of BaTiO_3-based Ceramics YANG Xiao-bing
Current Status and Tendency of MLCC Technology YANG Bang-chao
The Development of HDI Package Technology XIAN Fei
Phonetic Chip ISD4004 and Its Application in Intelligent Control System ZHANG Chang-nian
Capacitors: Price, General Economic Quantity and Market LU Shuo-lian
2001 Issues:  [06] [05] [04] [03] [02] [01]
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