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Electronic Components and Materials
FQ: 月刊
AD of Publication: 四川省成都市
Lanuage: 中文;
ISSN: 1001-2028
CN: 51-1241/TN
YP: 1982
Url: 中国电子学会;中国电子元件行业协会
Recommended Journals
Electronic Components and Materials
2008 -01
Catalog
Effect of TiCN on properties for (Ba_(0.85)Sr_(0.11)Pb_(0.04)) TiO_3-based PTC thermistor ceramics ZHENG Jin-qing,ZHAO Rui-hong(College of Material Science and Engineering,South China University of Technology,Guangzhou 510640,China)
Research progress of properties for glass-coated magnetic alloy microwires DI Yong-jiang,JIANG Jian-jun,BIE Shao-wei,TIAN Bin,HE Hua-hui(Dept of Electronic Sci & Techn,Huazhong University of Science & Technology,Wuhan 43007,China)
Effect of thermal input and Ni doping on strength in Sn-Ag solder NIE Jing-kai,ZHANG Bing-bing,GUO Fu,XIA Zhi-dong,LEI Yong-ping(College of Materials Science & Engineering,Beijing University of Technology,Beijing 100022,China)
Study on interface and shear behavior in lead-free solder joint DING Ya-ping,QI Fang-juan,SUN Li,YANG Ming-hui(College of Material Science and Engineering,Shijiazhuang Railway Institute,Shijiazhuang 050043,China)
Synthesis of spherical microfine nickel powders with RF plasma BAI Liu-yang1,3,YUAN Fang-li1,HU Peng1,LI Jin-lin1,TANG Qing2(1.State Key Laboratory of Multi-phase Complex System,Institute of Process Engineering,Chinese Academy of Sciences,Beijing 100080;2.Key Laboratory of Green Process Engineering,Institute of Process Engineering,Chinese Academy of Sciences,Beijing 100080;3.Graduate University of Chinese Academy of Sciences,Beijing 100049)
All-tantalum wet electrolytic capacitor with all-sealing structure WANG Xiu-yu,LIU Zhong-e,ZHANG Zhi-sheng,Bai Tian,HUANG Xiang-dong(School of Electronic Information Engineering,Tianjin University,Tianjin 300072,China)
Study on performance of AlN-TiC composites with microwave attenuation characteristics CHENG Wei-hua,LI Xiao-yun,QIU Tai,JIA Miao-lei(College of Materials Science and Engineering,Nanjing University of Technology,Nanjing 210009,China)
Effect of substitution of Sn~(4+) for Nb~(5+) on properties of Bi_2(Zn_(1/3)Nb_(2/3))_2O_7-based ceramics ZHANG Hong-xia,DING Shi-hua,CHEN Tao,SONG Tian-xiu,ZHANG Dong(College of Materials Science and Engineering,Xihua University,Chengdu 610039,China)
Effect of Mn in HDDR anisotropic NdFeCoB magnetic powder LIN Pei-hao,CHEN Xu,CHENG Jun,ZHOU Xiu-juan (Dept of Information Material Science and Engineering,Guilin University of Electronic Technology,Guilin 541004,Guangxi Zhuangzu Zizhiqu,China)
Study on preparation of BaNd_2Ti_4O_(12) microwave dielectric ceramics via polymeric precursor GAO Hui-juan1,XU Jian-mei1,2,WANG Hui1(1.Faculty of Material Science and Chemical Engineering,China University of Geosciences,Wuhan 430074,China;2.Hubei Ferroelectric and Piezoelectric Materials and Devices Key Laboratory(Hubei University),Wuhan 430062,China)
Development of aluminum electrolytic capacitors for green lighting LIANG Ya-qin(Nantong Shipping College,Nantong 226001,Jiangsu Province,China)
Application of low dissipation factor MLCC in RF circuit GUI Di,SUN Fei,LIN Zeng-jian(Dalian Dalicap Co.,Ltd,Dalian 116600,Liaoning Province,China)
AlN/SiO_2-B_2O_3-ZnO-Bi_2O_3 low temperature co-fired glass ceramics ZHAO Hong-sheng,GAO Nian-zi(Division of New Materials,Institute of Nuclear and New Energy Technology,Tsinghua University,Beijing 102201,China)
Some explanation of formed reasons for waste product in PTC component manufacture ZHU Bing-he1,ZHU Ying-quan2(1.Shanghai Institute of Ceramics,Chinese Academy of Science,Shanghai 200050,China;2.Chengdu Hongming Electronics Co.,Ltd,Chengdu 610051,China)
Study on a VOC-free flux for lead-free solder ZHANG Bing-bing,LEI Yong-ping,XU Dong-xia,LI Guo-wei,XIA Zhi-dong(Laboratory of Advanced Electronic Joining Materials,Beijing University of Technology,Beijing 100022,China)
Pretreatment of electronic components/ devices lead frame and determination of Cr~(6+) CHEN Zhi-dong1,2,TONG Wei-li1,WANG Wen-chang1,KONG Yong1,MITSUZAKI Naotoshi2(1.Department of Chemical Engineering & Technology,Jiangsu Polytechnic University,Changzhou 213164,Jiangsu Province,China;2.Changzhou JPU Qualtec Co.,Ltd,Changzhou 213164,Jiangsu Province,China)
Study on interfacial delamination of FCOB under thermal cycle loading SU Xi-ran,YANG Dao-guo,ZHAO Peng,GUO Dan(Dept of Mechanical & Electronic Engineering,Guilin University of Electronic Technology,Guilin 541004,Guangxi Zhuangzu Zizhiqu,China)
Thermal reliability analysis of package in PBGA LI Chang-geng1,LIN Dan-hua1,ZHOU Jie-min2(1.School of Physical Science and Technology,CSU,Changsha 410083,China;2.School of Energy Science and Engineering,CSU,Changsha 410083,China)
Effects of moisture diffusion and hygrothermal stress on reliability of SCSP YE An-lin,QIN Lian-cheng,KANG Xue-jing(College of Mechanical and Electric Engineering,Guilin University of Electronic Technology,Guilin 541004,Guangxi Zhuangzu Zizhiqu,China)
Design of broadband microstrip antenna using double negative metamaterial WANG Zhen-yu,ZHAO Hui-ling,SHEN Jing,MA Feng-jun(Department of Electronic Engineering,Northwestern Polytechnical University,Xi’an 710072,China)
Preparation of a novel NO_2 gas sensor based on SnO_2 thick film LIN Jin-yang(Fujian University of Technology,Fuzhou 350014,China)
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