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Electronic Components and Materials
FQ: monthly
AD of Publication: China
Lanuage: English
ISSN: 1001-2028
CN: 51-1241/TN
YP: 1982
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Electronic Components and Materials
2014 -01
Catalog
Effects of sputtering pressure on the properties of the Sb-doped SnO_2 transparent conductive thin films YANG Xiaowei;YANG Wenhao;YU Shihui;DING Linghong;ZHANG Weifeng;School of Physics and electronics,Henan University;
Oxidation characteristics of MnZn ferrite powder and their influences on sintering YIN Wenhui;DING Chuan;CAO Liangliang;LI Mengnan;ZENG Yanwei;School of Material Science and Engineering,Nanjing University of Technology;
Preparation and characterization of NiCuZn ferrite electromagnetism shielding sheet YAN Shuoqing;LIU Weihu;NIE Yan;WANG Xian;FENG Zekun;Department of Optical and Electronic Information,Huazhong University of Science and Technology;
Preparation and luminescent properties study of Gd_(0.95)(BO_3)_x(VO_4)_(1–x):Eu_(0.05)~(3+) red phosphors HUANG Weigang;LI Lei;LI Zhuo;College of Material Sciences and Engineering,Sichuan University;
Creep properties of Sn-0.3Ag-0.7Cu low-Ag lead-free micro-scale solder joints YIN Limeng;YAO Zongxiang;GENG Yanfei;LIN Jiexiang;LU Yuhao;School of Metallurgy and Materials Engineering,Chongqing University of Science and Technology;
Research progress on synthesis of LiFePO_4 cathode material using trivalent iron source ZHU Laidong;TIAN Yong;LI Hui;ZHANG Xixi;LUO Shaohua;Northwest Research Institute of Mining and Metallurgy;Gansu Daxiang Energy Science & Technology Co.,Ltd;School of Resources and Materials,Northeastern University at Qinhuangdao;
Influence of pH on the preparation of CZTS particles ZHOU Chao;GAO Yanmin;WANG Dan;School of Materials Science and Engineering,Jiangsu University of Science and Technology;
Growth and properties study of ZnO thin films on various substrates HE Jianting;WEI Qinqin;YANG Shulian;LI Tianze;School of Electrics and Electronics engineering,Shandong University of Technology;
Design of wide stopband HTS bandpass filter YANG Hong;ZHOU Yan;XIANG Gaolin;College of Optoelectrical Engineering,Chongqing University of Posts and Telecommunications;
A novel band-stop filter with defected ground structure CHEN Lin;Li Minquan;WANG Wei;HE Jiaquan;HUANG Wei;Key Laboratory of Intelligent Computing & Signal Processing,Ministry of Education,Anhui University;
Hexagonal-loop dual-mode microstrip bandpass filter ZHANG Youjun;CAO Yulu;MA Jiang;School of Information Engineering,Shanghai Maritime University;Zhengzhou Centrality of Quality and Technical Supervision;
Investigation for Parylene applied in millimeter-wave MMIC circuits TONG Xiaogang;AO Liaohui;SHI Xiukun;CHENG Yan;The 10th Institute of China Electronics Technology Group Corporation;
Thermal dissipation analysis of printed circuit boards with different laminating structures YU Yan;ZHU Yanjun;WANG Shouxu;HE Wei;XU Huan;State Key Laboratory of Electronic Thin Films and Integrated Devices,University of Electronic Science and Technology of China;Bomin Electronics Co.,Ltd;
Warpage analysis of FBGA packaging during assembling process LIU Peisheng;TONG Liangyu;SHEN Haijun;TAO Yujuan;HUANG Jinxin;MIAO Xiaoyong;Jiangsu Key Laboratory of ASIC Design,Nantong University;Nantong Fujitsu Microelectronics Co.,Ltd;
Optimization and selection of lead-free solder paste reflow process profile parameters WEN Guichen;LEI Yongping;LIN Jian;LIU Baoquan;BAI Hailong;QIN Junhu;College of Materials Science and Engineering,Beijing University of Technology;Yunnan Tin Material Co.,Ltd;
Optimum design of large area sheet reflow soldering WEI Ziling;CHEN Xu;ZHOU Jian;Nanjing Tongchuang Electronic Information Equipment Manufacturing Co.,Ltd;School of Materials Science and Engineering,Southeast University;
Reliability study of TMV stack solder joints in PoP package ZHANG Minshu;SONG Fubin;Department of Materials Science and Engineering,Xiamen University of Technology;Celestica Technology Ltd;
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