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Electronic Components and Materials
FQ: monthly
AD of Publication: China
Lanuage: English
ISSN: 1001-2028
CN: 51-1241/TN
YP: 1982
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Electronic Components and Materials
2015 -09
Research status of 3D silicon detectors YANG Jun;YIN Huaxiang;JIA Yuncong;LI Zhenjie;Key Laboratory of Microelectronics Devices & Integrated Technology
Synthesis and photocatalysis of 2-D MoS_2 based nano-materials XU Ying;BU Xiuming;WANG Pengpeng;WANG Ding;WANG Xianying;School of Materials Science and Engineering
Low-temperature sintering and microwave dielectric properties of CuBi_2(V_2O_5)-doped Li_2O-ZnO-TiO_2 ceramics HE Ming;Communication Engineering Department
Study on the properties of Bi_2O_3-ZnO-B_2O_3 sealing glass doping with transition metal oxides WU Xinyu;YU Xiaoxia;WANG Haifeng;College of Material Science and Engineering
Preparation and gas-sensing properties of WO_3/polyaniline nanocomposites GUI Yanghai;WANG Weimin;LIU Beibei;MIAO Zhaoyang;TIAN Junfeng;ZHAO Jianbo;Department of Material and Chemical Engineering
Solution-based controllable synthesis of chalcopyrite structure CuInS_2 thin film and their electrical performance characterization WANG Yue;ZHANG Jinghui;College of New Energy
Thermal stress analysis on multilayer structure of MEMS LIU Jiakai;Equipment Engineering College
Simulation method of foam sandwich absorbing material radar stealth property LONG Guoning;DU Zuojuan;HUANG Xiaozhong;ZHOU Ding;School of Physics and Electronics
Thermal stability and soft magnetic property of Fe_(74)Co_xY_(6-x)B_(20) alloys DONG Lirong;SONG Jian;YU Wanqiu;HUA Zhong;Key Laboratory of Functional Materials Physics and Chemistry of the Ministry of Education
Current situation and new trend of piezoelectric energy harvesters WANG Erping;GAO Jingxia;ZHANG Jinping;CAI Yanyan;ZHANG Yangyang;College of Information Engineering
Preparation process research status and development trend of Ag-SnO_2 electrical contact materials SI Fang;WANG Junbo;LIU Songtao;YANG Minge;YANG Erhui;College of Mechanical and Electronic Engineering
Effects of temperature on the performance of vanadium redox flow battery TANG Chongyue;YAN Gan;GAO Cunbo;ZHAO Zhensheng;LYU Yuxiang;College of Physics and Optoelectronics
Preparing of TiO_2 memristor using sol-gel method LI Zhen;ZHU Ji;School of Optical and Electronic Information
Design of a voltage-sampling circuit used in PSR converter WANG Jingwei;FENG Quanyuan;Institute of Microelectronics
Application of conductive adhesive in flip chip interconnection structure LIU Peisheng;YANG Longlong;LIU Yahong;LU Ying;Jiangsu Key Laboratory of ASIC Design
Review of IGBT thermal resistance measurement method LI Zhigang;ZHANG Yaling;CAO Bo;WANG Meiru;ZOU Cece;School of Electrical Engineering
Influences of boundary stress on the Curie temperature of lead-free BaTiO_3-based PTC thermistor materials TIAN Ye;CAO Quanxi;ZHAO Fangzhou;School of Advanced Materials and Nanotechnology
Delamination research of die and EMC interface of plastic packaging device LIU Peisheng;LU Ying;YANG Longlong;LIU Yahong;Jiangsu Key Laboratory of ASIC Design
Research on gapped phosphor coating that converts into white LEDs JIANG Bin;SONG Guohua;ZHANG Guanggeng;MIAO Jianwen;YU Pengfei;School of Science
Analysis and modeling of threshold characteristic for SOI LDMOS with high-k gate dielectric LI Liqun;TANG Shougen;ZHAO Hui;Aviation Engineering Institute
Reliability of PCB lead-free solder joints based on monitoring thermal fatigue state MAO Shuqin;GUO Lihong;XU Yanjun;CAO Yanbo;GUO Ruhai;Changchun Institute of Optics
Modified circularly polarized aperture-coupled triangular patch antenna YANG Fang;WEI Mingfei;WANG Min;WANG Chun;ZHOU Junni;School of Information and Control Engneering
Feed in different planes transition structure between CBCPW and SIW LU Ying;SHEN Liang;SHEN Ya;JIANG Peng;LU Yan;Nanjing Electronic Device Institute;The Military Representative Office of Chinese People's Liberation Army Stationed in the 528 Factory;Suzhou High Vocational &Technical School;
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