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Electronic Components and Materials
FQ: 月刊
AD of Publication: 四川省成都市
Lanuage: 中文;
ISSN: 1001-2028
CN: 51-1241/TN
YP: 1982
Url: 中国电子学会;中国电子元件行业协会
Recommended Journals
Electronic Components and Materials
2016 -01
Catalog
Research progress on dielectric mechanism of microwave dielectric ceramics HUANG Qi;ZHENG Yong;LYU Xuepeng;ZHU Linzheng;TU Yankun;College of Materials Science and Technology
Sintering process of low temperature co-fired Na_2O-B_2O_3-SiO_2 glass/Al_2O_3 composite materials ZHANG Peizhong;HU Yichen;WANG Chun;ZHANG Ming;College of Materials Science and Engineering
Selective electroless nickel plating on the surface of flexible ITO film without sensitizing WANG Junwei;XIA Wei;GUO Hu;WANG Tao;XIE Xinxiang;HE Jianping;College of Material Science and Technology
Synthesis and characterization of lithium iron phosphate/exfoliated graphite composite material KONG Lingyong;HUANG Shaozhen;SHANG Weili;FANG Dongsheng;CHEN Lingzhen;Shenzhen Dynanonic Co.
Preparation and electrochemical performance of attapulgite coated with nitrogen-doped carbon from polyaniline LIU Xindong;YING Zongrong;LU Jianjian;REN Zhenbo;WAN Hui;Department of Polymer Materials
Biomorphic synthesis of CoO/Co/C composite electrodes for high-performance supercapacitor KAN Xiamei;FU Rongrong;LUO Min;LIANG Bin;MA Jinfu;Chemistry and Chemical Engineering
Fabrication of MnCo_2O_4/nickel foam electrodes and the investigation of their electrochemical properties ZHANG Jie;XU Jiasheng;WANG Lin;QIAN Jianhua;Liaoning Province Key Laboratory for Synthesis and Application of Functional Compounds
Research progress of spray cooling with surfactant ZHANG Yuwei;LIU Ni;Institute of Refrigeration and Cryogenic Engineering
Study on determination of aluminum content in the groove liquid for electrode foil production LIANG Yaqin;Nantong Shipping College;
Progress of technologies and applications of ceramic substrate for the packaging of power electronics CHENG Hao;CHEN Mingxiang;HAO Ziliang;LIU Songpo;School of Mechanical Science and Engineering
Research progress of MIS for source/drain contact resistance reduction HUANG Bencheng;LIU Yingming;JING Xuezhen;ZHANG Beichao;XIE Chaoying;School of Material Science & Engineering
Fabrication and properties of flexible yellow organic light-emitting diodes SUN Xiuying;WU Xiaoxiao;LI Fushan;School of Physics and Information Engineering
Research on high temperature creep behavior of metal interconnects during electromigration CUI Haipo;DENG Deng;Shanghai Institute for Minimally Invasive Therapy
Inner thermal resistance analysis of power rectifier diodes based on structure function LI Ruguan;ZHOU Bin;XU Wei;ZENG Chang;LIAO Xueyang;Science and Technology on Reliability Physics and Application of Electronic Component Laboratory
Simulation design of thin film circulator based on substrate thinning structure WANG Lin;ZHENG Liang;ZHENG Hui;CUI Jiadong;Qin Huibin;Institute of Electron Device & Application
Compact ultra-wideband microstrip bandpass filter design LI Yulong;SONG Shuxiang;CEN Mingcan;FAN Dongdong;College of Electronic Engineering
Design of terahertz media slot Fresnel antenna PAN Wu;MA Yuanbo;ZHANG Huaquan;DAI Peng;College of Photoelectric Engineering
Compact high isolation of MIMO ultra-wideband antenna study CHEN Xianming;YANG Yadong;LIU Shuhuan;Xijing University;Xi'an Jiaotong University;
Influences of grain structures of Ge_2Sb_2Te_5 on the reset current of phase change memory cell WANG Yuchan;KANG Jiehu;WANG Yuhan;School of Optoelectronic Engineering
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