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Electronics Process Technology
FQ: 双月
AD of Publication: 山西省太原市
Lanuage: 中文;
ISSN: 1001-3474
CN: 14-1136/TN
YP: 1980
Url: 中国电子科技集团公司第二研究所
Recommended Journals
Electronics Process Technology
2004 -06
Surface Acoustic Wave Motor ZHOU Guang-hua, LIU Jing-quan, YANG Bin, HUANG Shui-hua(Shanghai Jiao Tong University,Shanghai200030, China) 
Research Status of Reflow Soldering Process in SMT HUANG Bing-yuan, HAN Guo-ming, FAN Qiang,MAO Xin-long(Tianjin University,Tianjin300072,China) 
Research on Lead-free Solder Alloy Sn-0.7CuPrepared By Mechanical Alloying LIU Xin, LEI Yong-ping11, XIA Zhi-dong1, SHI Yao-wu1,ZHANG Shu-guang2(1. Beijing University of Technology, Beijing100022,China;2.General Research Institute for Nonferrous Metals, Beijng100088,China ) 
Effect of parameters of reflow oven on the Reflow Profile FENG Zhi-gang,YU Ding-wen,ZHU Yu-he(EDMI of China Academy of Electronics and Information Technology,Beijing100041,China) 
Study of the Void PTH of the Multilayer PCB CHI Hai-rong( The Institute of Electronic Engineering of CAEP, Mianyang621900, China) 
Printed Circuit Board Designing and the Technologyof Anti-Interference in the Single Chip Microcomputer System ZHOU Han-xiao,YUAN Hui-mei(Capital Teachers University,Beijing100037,China) 
Overload Acceleration Sensor With Low Temperature Drift YAN Gui-ping(Shanxi Kotel Micro Technique Co.Ltd,Taiyuan030006,China) 
Developing Trend of Liquid Crystal Pour Machine YIN Wan-gen(CETC No.2 Research Institute,Taiyuan030024,China) 
Quality Control of Production Process of Manufacture Shop Lü Shu-hong,WU Yong(Taiyuan tool factory, Taiyuan030002, China) 
Microelectronic Packaging Technology and SMT Will Join Hands in the Future KUANG Yan-xiang,ZHU Song-chun(CETC No.43 Research Institute,Hefei230022,China) 
Research of PCBA Assemble in Lead Free BAI Yun,LIU Yan-xin, (Beijing Zhuanglian Electronic Engineering CO.,LTD,Beijing 100041,China)
2004 Issues:  [01] [02] [03] [04] [05] [06]
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